《Modic》聚烯烴系樹脂 Thermoplastic polyolefine resins
產品名稱 Product
聚烯烴系接著性樹脂(Thermoplastic polyolefin)
產品介紹 Introduction
MODIC是一種在無極性聚烯烴中導入極性基，增強了聚烯烴與其他材料黏著性的特殊材料。
MODIC可與聚醯胺、EVOH、聚酯、金屬和聚烯材料黏著。
較強的黏著效果。與其他材料（聚醯胺，EVOH，聚酯，金屬，聚烯烴）有很強的黏著性。優良的物性和成型加工性能。與聚烯烴一樣具有優越的機械加工特性，耐熱性和成型特性。食品衛生性。通過聚烯烴等衛生協會的認證。
MODIC tie-layer resin is acid grafted polyolefin which adds polar groups to a non-polar polyolefin which provides adhesion between polyolefin and other materials.
MODIC can adhere to PA, PET, metals and PO.
It has good physical properties and ease of processing. it maintains polyolefin-like processing characteristics including: mechanical strength, thermal resistance and moldability. Food compliant grades for various substrates which have approval by sanitary authorities are also available.
產品用途 Applications
由於具有優越的黏著性和成型加工性能，廣泛應用於共擠出薄膜、瓶材、 管材、壓出薄膜、熱黏著薄膜、粉末噴塗材料等多層薄膜、壓膜領域的黏合材料。改良聚丙烯和其他樹脂共混時的相容性，或者與木粉、 無機填充物共混時‚更可有效發揮其改質的特性。
The excellent adhesion properties and easy of processing allows MODIC to be used widely as adhesives in multilayers applications such as co-extruded films, bottles, pipe coating, extrusion coating with lamination, powder coating materials and cast films. Improve the compatibility of PP and other resins during mixing, or as coupling agent with wood powder and inorganic fillers to improve the overall properties of the alloy
產品名稱 Product
聚烯烴系易撕性樹脂(Thermoplastic polyolefin)
MODIC Peelable Modified Polymer Alloy ( Peelable sealant resin )
產品介紹 Introduction
功能性樹脂MODIC是以苯乙烯等材料所組成的聚合性乙烯基單體，經過化學改性的聚烯烴類合金。
MODIC is chemically modified polyolefin of an alloy of styrene and polyethylene.
- 易剝離材料使用 • Peelable material usage
- 剝離順暢並無殘留線頭的平滑剝離
- 無論熱封溫度是低溫或高溫，均具有穩定的剝離強度
- Smooth & easy peel functions with little or no residue after peeling.
- Use in a wide range of heat seal temperatures but still maintain stable & uniform seal/peel characteristic
- 改質材料使用 Modifier usage
- 可應用於苯乙烯，丙烯酸酯，醋酸乙烯等多種材料的改質用途使用
- Can be used to modify the properties of styrene, acrylic, vinyl acetate during applications.
產品用途 Applications
易剝離材料（塑膠容器的蓋子，PE容器的蓋子等）
電線用材料（半導體外部易剝層等）
各種改良材料
Easy to peel material ( lid for plastic bottle, PE containers cap )
Cable raw materials ( easy peelable material for semi-conductor )
Modifiers